Analysis and test of electromigration failures in FPGAs

With the scaling of submicron device dimensions, the current density and the temperature of interconnects have increased many folds leading to component failure due to electromigration. This paper analyzes the effect of electromigration failures in the interconnect of SRAM-based Field Programmable Gate Arrays (FPGAs). The Mean Time to Failure (MTF) of interconnects is calculated for different benchmark circuits and the variation of current density with MTF is observed. A frequency domain Built-in-Self Test (BIST) scheme is proposed which employs Arithmetic Fourier Transform (AFT) to obtain the spectrum of control sequences to detect weak logic signals.