Title :
A self-defined communication protocol of transport layer in hierarchy transaction - level architecture for SOC verification
Author :
Ruan, A.W. ; Liao, Y.B. ; Li, P. ; Li, W.C. ; Li, W.
Author_Institution :
State Key Lab. of Electron. Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
A hierarchy transaction-level architecture consisting of physical layer, transport layer, transaction layer and application layer can improve system-on-a-chip (SOC) verification reliability and efficiency greatly. Transport layer of the hierarchy transaction-level architecture is responsible for end-to-end message transmission between software side and hardware side without caring about modules of upper layers. Time division multiplexing access (TDMA) scheme is used for logic multi-channel transmission by mapping to the unique physical channel, or PCI bus, in the hierarchy transaction-level architecture. To implement multiplexing of logic channels, a communication protocol of transport layer is required to be self-defined and will be presented in the paper, including method to realize end-to-end communication, definition format of a data packet and its header. Experiment result demonstrates the self-defined communication protocol can work efficiently.
Keywords :
protocols; system-on-chip; time division multiple access; PCI bus; SoC verification; TDMA scheme; application layer; data packet; definition format; end-to-end message transmission; hierarchy transaction-level architecture; logic multichannel transmission; physical channel; physical layer; self-defined communication protocol; system-on-a-chip; time division multiplexing access; transaction layer; transport layer; verification reliability; Access protocols; Application software; Computer architecture; Hardware; Logic; Physical layer; System-on-a-chip; Time division multiple access; Time division multiplexing; Transport protocols;
Conference_Titel :
Communications, Circuits and Systems, 2009. ICCCAS 2009. International Conference on
Conference_Location :
Milpitas, CA
Print_ISBN :
978-1-4244-4886-9
Electronic_ISBN :
978-1-4244-4888-3
DOI :
10.1109/ICCCAS.2009.5250330