DocumentCode :
3384985
Title :
Patch antenna miniaturization using thick truncated textured ceramic substrates
Author :
Kula, J. ; Psychoudakis, D. ; Chen, C.-C. ; Volakis, J.L. ; Halloran, J.H.
Author_Institution :
Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
Volume :
4
fYear :
2004
fDate :
20-25 June 2004
Firstpage :
3800
Abstract :
The recent availability of high-contrast, low-loss ceramic materials provides us with possibilities for significant antenna miniaturization. The paper explores the use of low temperature cofired ceramic substrates in producing a miniaturized patch antenna design. Of particular concern in the design are substrate thickness, impedance matching, radiation efficiency and bandwidth due to the high-contrast ceramic. We propose a thick substrate to increase bandwidth. However, the substrate is truncated and/or modified to mitigate surface wave loss. Also, a textured substrate is proposed for dielectric constant control and for improved impedance matching. Gain measurements are given along with the analysis. Further, the effect of the finite ground plane is examined. The paper provides both return loss and overall gain calculations and measurements.
Keywords :
UHF antennas; ceramics; dielectric devices; electric impedance; impedance matching; microstrip antennas; substrates; surface electromagnetic waves; 1 to 3 GHz; antenna bandwidth; antenna gain; dielectric constant control; finite ground plane; high-contrast ceramic materials; impedance matching; input impedance; low temperature cofired ceramic substrates; low-loss ceramic materials; patch antenna miniaturization; radiation efficiency; return loss; substrate thickness; surface wave loss; textured substrate; thick truncated textured ceramic substrates; truncated substrate; Bandwidth; Ceramics; Dielectric constant; Dielectric loss measurement; Dielectric substrates; Gain measurement; Impedance matching; Patch antennas; Surface waves; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation Society International Symposium, 2004. IEEE
Print_ISBN :
0-7803-8302-8
Type :
conf
DOI :
10.1109/APS.2004.1330176
Filename :
1330176
Link To Document :
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