• DocumentCode
    3385251
  • Title

    Large diameter germanium wafers for CPV applications

  • Author

    Laureyn, Wim ; Geens, Wim ; Romandic, Igor ; Seghers, Geert ; Dessein, Kristof ; Quaeyhaegens, Carl

  • Author_Institution
    Umicore, Electro-Optic Materials, Watertorenstraat 33, B-2250 Olen, Belgium
  • fYear
    2008
  • fDate
    11-16 May 2008
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Umicore has a long tradition in supplying germanium wafers to the space solar cell market. The main product for this application up to today is a substrate with a diameter of 100 mm and a thickness in the range of 140 – 180 ¼m. With the new emerging market of high-efficiency concentrator photovoltaics (CPV) the need has arisen to investigate the use of germanium wafers with a larger diameter. Especially for small size CPV cells, increasing the wafer diameter will significantly reduce the processing cost per die, which will also contribute to lowering the overall cost/kWh of CPV technology. In this paper the development of dislocation free 150 mm germanium wafers for CPV applications is presented. Different wafer thicknesses down to 200 ¼m have been realized. The process steps starting from crystal pulling up to final epi-cleaning and drying will be addressed. First measurement results on wafer level are shown as well. Finally, the future challenges in optimizing the 150 mm wafer specifications will be reviewed.
  • Keywords
    Chemical lasers; Cleaning; Conductivity; Costs; Germanium; III-V semiconductor materials; Microelectronics; Photovoltaic cells; Production; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2008. PVSC '08. 33rd IEEE
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-1640-0
  • Electronic_ISBN
    0160-8371
  • Type

    conf

  • DOI
    10.1109/PVSC.2008.4922901
  • Filename
    4922901