Title :
A sub-THz folded substrate integrated waveguide in IBM 130 nm CMOS process
Author :
Mahani, Mohammad Shahidzadeh ; Roberts, Gordon
Author_Institution :
Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, QC, Canada
Abstract :
This paper presents a compact sub-THz substrate integrated waveguide (SIW) interconnect that is designed in IBM 130 nm digital CMOS process. The footprint of the proposed SIW design is smaller than previous implementations through the application of a folded structure. The TE10 mode of the waveguide operation is excited using a current-loop excitation technique that imposes minimum layout area and is fully embedded inside the waveguide structure. Design formulas as well as full-wave simulation results are presented which show a promising performance over the frequency range of 180 GHz-220 GHz.
Keywords :
CMOS digital integrated circuits; millimetre wave integrated circuits; substrate integrated waveguides; IBM 130 nm digital CMOS process; TE10 mode; compact sub-THz SIW interconnect; compact sub-THz substrate integrated waveguide interconnect; current-loop excitation technique; folded structure; frequency 180 GHz to 220 GHz; full-wave simulation; minimum layout area; size 130 nm; waveguide operation; waveguide structure; CMOS integrated circuits; CMOS process; Cutoff frequency; Electromagnetic waveguides; Integrated circuit interconnections; Metals; Substrates;
Conference_Titel :
Millimeter Waves (GSMM), 2015 Global Symposium On
Conference_Location :
Montreal, QC
DOI :
10.1109/GSMM.2015.7175459
