DocumentCode
3385904
Title
Investigations on the influence of Peltier effect and electromigration during growth of InP, InGaP and InAsP by liquid phase electro-epitaxy
Author
Fareed, R. S Qhalid ; Dhanasekaren, R.
Author_Institution
Crystal Growth Centre, Anna Univ., Madras, India
fYear
1996
fDate
21-25 Apr 1996
Firstpage
564
Abstract
Liquid phase electroepitaxy is one of the novel techniques for the growth of III-V compound semiconductors. In this technique, growth is carried out by passing an electric field through the substrate-solution interface under isothermal conditions. The two major factors influencing the growth are Peltier effects and electromigration. In the present communication, a model has been developed to understand the growth mechanism of InP, InGaP and InAsP semiconductors. The model is based on the diffusion and electromigration of the solute atoms. During Peltier cooling conditions, growth occurs. When the direction of the electric field is reversed, dissolution of solute atoms is observed due to Peltier heating at the interface. Computer simulation has been employed to construct the concentration profiles of the solute atoms in the immediate vicinity of the growing interface in the In rich melt during the growth of InP
Keywords
III-V semiconductors; Peltier effect; digital simulation; electromigration; gallium compounds; indium compounds; liquid phase epitaxial growth; semiconductor growth; III-V compound semiconductors; In rich melt; InAsP; InGaP; InP; Peltier effect; computer simulation; concentration profiles; dissolution; electric field; electromigration; growth; growth mechanism; isothermal conditions; liquid phase electro-epitaxy; solute atoms; substrate-solution interface; Cooling; Crystalline materials; Electromagnetic heating; Electromigration; Indium phosphide; Isothermal processes; Microwave devices; Optical device fabrication; Semiconductor materials; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Indium Phosphide and Related Materials, 1996. IPRM '96., Eighth International Conference on
Conference_Location
Schwabisch-Gmund
Print_ISBN
0-7803-3283-0
Type
conf
DOI
10.1109/ICIPRM.1996.492309
Filename
492309
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