Title :
2002 IEEE International Integrated Reliability Workshop. Final Report (Cat. No.02TH8634)
Keywords :
reliability; Cu interconnects; NBTI phenomena; high-k dielectrics; hot carrier degradation; product reliability; reliability; thin oxides;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2002. IEEE International
Conference_Location :
Lake Tahoe, CA, USA
Print_ISBN :
0-7803-7558-0
DOI :
10.1109/IRWS.2002.1194222
