DocumentCode :
3386787
Title :
Polarity dependent reliability of advanced MOSFET using MOCVD nitrided Hf-silicate high-k gate dielectric
Author :
Zhang, J. ; Zhao, E. ; Xiang, Q. ; Chan, J. ; Jeon, J. ; Goo, J.-S. ; Marathe, A. ; Ogle, B. ; Lin, M.R. ; Taylor, K.
Author_Institution :
Technol. Dev. Group, AMD, Sunnyvale, CA, USA
fYear :
2002
fDate :
21-24 Oct. 2002
Firstpage :
92
Lastpage :
95
Abstract :
We report reliability of MOSFETs with MOCVD nitrided Hf-silicate (HfSiON) high-k gate dielectric. HfSiON has shown superior electrical characteristics, such as low leakage relative to SiO2 and high mobility compared to other high-k gate dielectrics. SILC is found to be comparable to SiO2 and better than Hf-silicate without nitridation. TDDB and BTI reveal significant difference between inversion and accumulation mode. Polarity-dependent charge trapping and defect generation are observed and attributed to asymmetric band diagram as well as dissimilar charging processes in two stress modes. Trap-assisted tunneling is evidenced by its strong temperature dependence. Charge pumping tests indicate higher interface density compared to SiO2/Si. The Weibull slope is determined to be about 3, showing robust wear-out quality of the high-k dielectric.
Keywords :
MOCVD coatings; MOSFET; Weibull distribution; carrier mobility; dielectric thin films; electric breakdown; hafnium compounds; interface states; leakage currents; nitridation; semiconductor device reliability; tunnelling; BTI; Hf-silicate high-k gate dielectric; HfSiON; MOCVD; MOSFET; SILC; TDDB; Weibull slope; accumulation mode; band structure; carrier mobility; charge pumping; charge trapping; defect generation; electrical characteristics; interface state density; inversion mode; nitridation; polarity dependence; reliability; temperature dependence; trap-assisted tunneling; wear-out; Charge pumps; Electric variables; High-K gate dielectrics; MOCVD; MOSFET circuits; Robustness; Stress; Temperature dependence; Testing; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2002. IEEE International
Print_ISBN :
0-7803-7558-0
Type :
conf
DOI :
10.1109/IRWS.2002.1194241
Filename :
1194241
Link To Document :
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