• DocumentCode
    3386926
  • Title

    High voltage SOI SJ-LDMOS on composite substrate

  • Author

    Wang, Wenlian ; Zhang, Bo ; Li, Zhaoji

  • Author_Institution
    State key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2009
  • fDate
    23-25 July 2009
  • Firstpage
    614
  • Lastpage
    616
  • Abstract
    A new super junction LDMOS (SJ-LDMOS) on partial silicon-on-insulator (SOI) with composite substrate is presented in this paper. The thin super junction structure on the buried oxide (BOX) provides the surface low on-resistance path, which is attributed to the heavy doping trait of SJ. The N-buffer layer is introduced under the BOX to sustain vertical voltage, which reduces the substrate-assisted depletion (SAD) effect. In addition, the N-buffer layer increases the vertical breakdown voltage without increasing the thickness of BOX. The proposed device preserves the isolation advantage of SOI device because the N-buffer layer is self-isolation. Numerical simulation results indicate that a breakdown voltage of 280 V for the proposed device with drift length of 15 mum, comparing with a breakdown voltage of 150 V for conventional SOI SJ-LDMOS suffering for the SAD effect.
  • Keywords
    MOSFET; buffer layers; semiconductor device breakdown; silicon-on-insulator; N-buffer layer; SAD effect; Si-SiO2; buried oxide; composite substrate; high voltage SOI super junction-LDMOS; laterally diffused metal oxide semiconductor; numerical simulation; silicon-on-insulator; substrate-assisted depletion; vertical breakdown voltage; voltage 150 V; voltage 280 V; Breakdown voltage; Current density; Doping; Instruments; Isolation technology; Numerical simulation; Power integrated circuits; Silicon on insulator technology; Thin film devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications, Circuits and Systems, 2009. ICCCAS 2009. International Conference on
  • Conference_Location
    Milpitas, CA
  • Print_ISBN
    978-1-4244-4886-9
  • Electronic_ISBN
    978-1-4244-4888-3
  • Type

    conf

  • DOI
    10.1109/ICCCAS.2009.5250425
  • Filename
    5250425