DocumentCode
3387027
Title
Rationale for optical interconnect
Author
Scandurra, Alberto
Author_Institution
On-Chip Commun. Syst. (OCCS), STMicroelectronics, Catania, Italy
fYear
2010
fDate
May 30 2010-June 2 2010
Firstpage
3597
Lastpage
3600
Abstract
The System on Chip (SoC) approach is now the essential solution for delivering competitive performance and cost in today´s challenging electronics market. Ever-increasing integration density means that many design and fabrication issues arise however, and the electrical limits of interconnect wires are in particular a limiting factor for performance. According to this scenario, a new technology is required for the on-chip interconnect, in order to overcome current physical and performance issues; one possible solution is optical interconnect, exploiting the many benefits of light as vector to transport information across the chip. From an industrial point of view, it is fundamental that such a new technology be fully CMOS compatible, in order to be able to continue to use current SoC design methodologies as well as manufacturing equipments for the remaining electronic part of the chip.
Keywords
integrated circuit design; optical interconnections; system-on-chip; SoC design; design issues; electronics market; fabrication issues; integration density; limiting factor; manufacturing equipment; on-chip interconnect; optical interconnect; system on chip; CMOS technology; Consumer electronics; Costs; Design methodology; Electronics industry; Manufacturing industries; Optical device fabrication; Optical interconnections; System-on-a-chip; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
Conference_Location
Paris
Print_ISBN
978-1-4244-5308-5
Electronic_ISBN
978-1-4244-5309-2
Type
conf
DOI
10.1109/ISCAS.2010.5537790
Filename
5537790
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