• DocumentCode
    3387027
  • Title

    Rationale for optical interconnect

  • Author

    Scandurra, Alberto

  • Author_Institution
    On-Chip Commun. Syst. (OCCS), STMicroelectronics, Catania, Italy
  • fYear
    2010
  • fDate
    May 30 2010-June 2 2010
  • Firstpage
    3597
  • Lastpage
    3600
  • Abstract
    The System on Chip (SoC) approach is now the essential solution for delivering competitive performance and cost in today´s challenging electronics market. Ever-increasing integration density means that many design and fabrication issues arise however, and the electrical limits of interconnect wires are in particular a limiting factor for performance. According to this scenario, a new technology is required for the on-chip interconnect, in order to overcome current physical and performance issues; one possible solution is optical interconnect, exploiting the many benefits of light as vector to transport information across the chip. From an industrial point of view, it is fundamental that such a new technology be fully CMOS compatible, in order to be able to continue to use current SoC design methodologies as well as manufacturing equipments for the remaining electronic part of the chip.
  • Keywords
    integrated circuit design; optical interconnections; system-on-chip; SoC design; design issues; electronics market; fabrication issues; integration density; limiting factor; manufacturing equipment; on-chip interconnect; optical interconnect; system on chip; CMOS technology; Consumer electronics; Costs; Design methodology; Electronics industry; Manufacturing industries; Optical device fabrication; Optical interconnections; System-on-a-chip; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), Proceedings of 2010 IEEE International Symposium on
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4244-5308-5
  • Electronic_ISBN
    978-1-4244-5309-2
  • Type

    conf

  • DOI
    10.1109/ISCAS.2010.5537790
  • Filename
    5537790