• DocumentCode
    3387097
  • Title

    One-dimensional estimation of interconnect temperatures

  • Author

    Labun, A. ; Jensen, James

  • Author_Institution
    Hewlett Packard Corp., Shrewsbury, MA, USA
  • fYear
    2002
  • fDate
    21-24 Oct. 2002
  • Firstpage
    155
  • Lastpage
    158
  • Abstract
    The solution of the 1D heat equation gives the self-heating temperature trajectories in ULSI interconnect networks. The method, implemented in an existing electromigration reliability verification code, requires virtually no incremental computational resources. Its accuracy is comparable to 3D finite element modelling for interconnects embedded in either SiO2 or low-k dielectrics.
  • Keywords
    ULSI; electromigration; integrated circuit interconnections; integrated circuit modelling; integrated circuit reliability; SiO2; ULSI interconnect network; electromigration reliability; low-k dielectric; one-dimensional heat equation; self-heating temperature; Dielectric substrates; Equations; Equivalent circuits; Integrated circuit interconnections; Resistance heating; Temperature; Thermal conductivity; Thermal resistance; Ultra large scale integration; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2002. IEEE International
  • Print_ISBN
    0-7803-7558-0
  • Type

    conf

  • DOI
    10.1109/IRWS.2002.1194256
  • Filename
    1194256
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3387097