Title :
One-dimensional estimation of interconnect temperatures
Author :
Labun, A. ; Jensen, James
Author_Institution :
Hewlett Packard Corp., Shrewsbury, MA, USA
Abstract :
The solution of the 1D heat equation gives the self-heating temperature trajectories in ULSI interconnect networks. The method, implemented in an existing electromigration reliability verification code, requires virtually no incremental computational resources. Its accuracy is comparable to 3D finite element modelling for interconnects embedded in either SiO2 or low-k dielectrics.
Keywords :
ULSI; electromigration; integrated circuit interconnections; integrated circuit modelling; integrated circuit reliability; SiO2; ULSI interconnect network; electromigration reliability; low-k dielectric; one-dimensional heat equation; self-heating temperature; Dielectric substrates; Equations; Equivalent circuits; Integrated circuit interconnections; Resistance heating; Temperature; Thermal conductivity; Thermal resistance; Ultra large scale integration; Wire;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2002. IEEE International
Print_ISBN :
0-7803-7558-0
DOI :
10.1109/IRWS.2002.1194256
