DocumentCode
3387409
Title
Excimer lasers as tools for material processing in manufacturing
Author
Endert, H.
Author_Institution
Lambda Phys. GmbH, Gottingen, Germany
fYear
1996
fDate
5-9 Aug. 1996
Firstpage
28
Lastpage
29
Abstract
Since their initial demonstration 20 years ago, excimer lasers have developed from physicists\´ "toys" to powerful tools, offering unique benefits to a wide range of applications. Nearly all technical (plastics, ceramics, glasses, metals, semiconductors, composites) and biological/medical materials can be structured by the intense ultraviolet (UV) laser lights. Drilling of microholes for ink jet nozzle heads and for MCM microelectronic packaging, stripping of very tiny wires, annealing of TFT\´s for flat panel displays and high quality marking are well-known industrial introduced examples of this technique. Recently two very important breakthroughs were achieved. The first is in regard to the performance of the excimer laser itself. The second one is a much more advanced way of using UV photons more efficiently.
Keywords
ceramics; composite materials; excimer lasers; flat panel displays; glass; integrated circuit packaging; laser beam annealing; laser beam effects; laser beam machining; laser materials processing; metals; multichip modules; plastics; semiconductors; thin film transistors; MCM microelectronic packaging; TFT; UV lasers; annealing; biological/medical materials; ceramics; composites; drilling; excimer lasers; flat panel displays; glasses; ink jet nozzle heads; intense ultraviolet laser; manufacturing; material processing; metals; microholes; plastics; semiconductors; stripping; wires; Bioceramics; Biological materials; Glass; Laser theory; Manufacturing processes; Materials processing; Plastics; Power lasers; Semiconductor device manufacture; Semiconductor lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Applications of Lasers in Materials Processing/Broadband Optical Networks/Smart Pixels/Optical MEMs and Their Applications. IEEE/LEOS 1996 Summer Topical Meetings:
Conference_Location
Keystone, CO, USA
Print_ISBN
0-7803-3175-3
Type
conf
DOI
10.1109/LEOSST.1996.540664
Filename
540664
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