Author_Institution :
Motorola Inc., Chandler, AZ, USA
Abstract :
Modern wafer fabs generate an immense volume of process and electrical test data for process monitoring, yield improvement, and device characterization. The data can be in the form of in-line process control measurements (CD, overlay, film thickness, etc.), defect wafer maps, die sort maps, and parametric test results. It is a significant challenge to manage and extract the information needed for process monitoring, device diagnostics, yield enhancement, and failure analysis. This paper describes how a Yield Management System (YMS) can be used to facilitate collection, extraction, and analysis of fab data. One of the primary functions of the YMS is to serve as a datahub for the collection of (patterned and unpatterned) wafer inspection data. The YMS provides a single interface from which fab personnel can access multiple data types such as defect data from in-line wafer inspections, wafer yield data from electrical test, equipment data from the WIP system, etc. The YMS also provides tools for chart creation, correlation, and analysis. Examples of how to use a YMS to improve fab monitoring and increase productivity are provided. The benefits and issues for implementing a yield management system are discussed
Keywords :
data analysis; electronic engineering computing; inspection; integrated circuit yield; manufacturing data processing; monitoring; process control; production engineering computing; IC manufacture; chart creation; correlation; defect data; equipment data; fab monitoring; integrated yield analysis; productivity; wafer inspection data collection; wafer yield data; yield enhancement; yield management system; Character generation; Condition monitoring; Data analysis; Data mining; Failure analysis; Inspection; Personnel; Process control; Testing; Thickness measurement;
