DocumentCode
3387813
Title
Advances in excimer laser surface processing of materials
Author
Jervis, T.R. ; Nastasi, M. ; Hirvonen, J.-P.
Author_Institution
Div. of Mater. Sci. & Technol., Los Alamos Nat. Lab., NM, USA
fYear
1996
fDate
5-9 Aug. 1996
Firstpage
38
Lastpage
39
Abstract
The use of pulsed excimer lasers to surface processing of materials hinges on an understanding of the nature of the interaction between the laser energy and the material. One of the advantages of excimer laser processing is the relative uniformity of that interaction across diverse materials. The short wavelength, (200-400 nm depending on the laser gas) and the short pulse length (30 ns) mean that for most materials, the energy is absorbed in a region of the surface that is shallow (10 nm) relative to the thermal diffusion length (100 nm) in the material.
Keywords
excimer lasers; laser materials processing; surface treatment; 10 nm; 200 to 400 nm; 30 ns; excimer laser processing; excimer laser surface processing; laser energy; materials; pulsed excimer lasers; short pulse length; surface processing; thermal diffusion length; Chromium; Cooling; Gas lasers; Kinetic theory; Laser theory; Optical materials; Optical pulses; Surface emitting lasers; Surface resistance; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Applications of Lasers in Materials Processing/Broadband Optical Networks/Smart Pixels/Optical MEMs and Their Applications. IEEE/LEOS 1996 Summer Topical Meetings:
Conference_Location
Keystone, CO, USA
Print_ISBN
0-7803-3175-3
Type
conf
DOI
10.1109/LEOSST.1996.540669
Filename
540669
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