Title :
Multiphysics modeling of integrated microfluidic-thermoelectric cooling for stacked 3D ICs
Author :
Furmanczyk, M. ; Wilkerson, P. ; Przekwas, A.
Author_Institution :
CFD Res. Corp., Huntsville, AL, USA
Abstract :
Three-dimensional integrated circuits (3D IC) are fabricated by vertically stacking a number of thinned dies on top of each other with interconnects between them. 3D IC can significantly improve circuit performance and offer the promise of integrating various technologies (memory, logic, RF, mixed-signal, optoelectronics) within a single block. This high-density integration however, causes severe thermal management problems. New cooling concepts and novel design tools are needed to accelerate the transition of 3D IC technology from research labs to the commercial market. The objective of this paper is two fold: to present novel multiphysics modeling tools CFD-ACE+ for 3D ICs, and to demonstrate how these tools have been used to design a new concept of thermoelectric-fluidic active cooling device for refrigerative thermal management of 3D IC.
Keywords :
cooling; electronic engineering computing; integrated circuit modelling; integrated circuit packaging; mesh generation; microfluidics; thermal management (packaging); thermoelectric devices; CFD-ACE+ multiphysics modeling tool; cooling; high-density integration; integrated thermoelectric-fluidic active cooling device; liquid heat exchanger; mesh generation; refrigerative thermal management; stacked 3D IC multiphysics modeling; thermal management problems; thinned die vertical stacking; Acceleration; Circuit optimization; Cooling; Integrated circuit interconnections; Integrated circuit technology; Logic circuits; Radio frequency; Stacking; Thermal management; Three-dimensional integrated circuits;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
Print_ISBN :
0-7803-7793-1
DOI :
10.1109/STHERM.2003.1194336
