Title :
Development of a high performance heat sink based on screen-fin technology
Author :
Li, Chen ; Wirtz, R.A.
Author_Institution :
Mech. Eng. Dept., Nevada Univ., Reno, NV, USA
Abstract :
In this paper, we describe a novel high-performance heat sink based on screen-fin technology. The structural features of the heat sink are presented. The apparatus to measure both the pressure drop and heat transfer performance is described. Correlation equations of friction factor and Colburn-j factor as a function of the divergence half angle θ, coolant properties and flow rate through the mesh are formulated. A semiempirical model is used to predict the heat exchanger pressure drop, thermal performance and to design prototype heat sinks. Prototypes are built and tested. By screen-fin technology, the best performance of this kind of heat sink with external dimensions: 76.2 mm wide, 63.5 mm deep with 38.1 mm high screen-laminate fins is 4.3 Watt/°C at 62.3 Pa pressure drop of air flow through the heat sink.
Keywords :
heat exchangers; heat sinks; laminates; thermal management (packaging); 38.1 mm; 63.5 mm; 76.2 mm; coolant properties; divergence half angle; friction/Colburn-j factor correlation equations; heat exchanger pressure drop; heat transfer performance; high performance heat sink; screen-fin technology; screen-laminate fins; through mesh flow rate; Cooling; Costs; Electronic packaging thermal management; Flexible manufacturing systems; Friction; Heat sinks; Heat transfer; Prototypes; Thermal conductivity; Thermal factors;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
Print_ISBN :
0-7803-7793-1
DOI :
10.1109/STHERM.2003.1194339
