• DocumentCode
    3388833
  • Title

    Changing from a tool availability approach to a tool efficiency approach

  • Author

    Peter, Ehweiner Hans

  • Author_Institution
    Siemens SA, Corbeil Essonnes, France
  • fYear
    1997
  • fDate
    10-12 Sep 1997
  • Firstpage
    103
  • Lastpage
    108
  • Abstract
    The semiconductor industry is one of the most capital intensive industries. To build a new eight inch fab requires approximately $2 billion dollars for initial startup. This cost tends to increase as the size of the wafers increases. Bearing this in mind, it is very clear that a key measurement for the performance of a fab is the allocation of capital weighted by the tool utilization. If we are measuring the tool utilization by DGR (daily going rate), it is very clear that the tool utilization is directly dependent on the efficiency of the tool set. This paper presents the actions which were taken in Essonnes, France to increase and manage manufacturing efficiency within a fixed budget
  • Keywords
    electronics industry; integrated circuit manufacture; management; planning; production; daily going rate; fixed budget; manufacturing efficiency; semiconductor industry; tool availability approach; tool efficiency approach; tool utilization; wafer fabrication facility; Costs; Dry etching; Electronics industry; Financial management; International collaboration; Logistics; Manufacturing processes; Production facilities; Pulp manufacturing; Random access memory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1997. IEEE/SEMI
  • Conference_Location
    Cambridge, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-4050-7
  • Type

    conf

  • DOI
    10.1109/ASMC.1997.630715
  • Filename
    630715