Title :
The urgent need for widely-accepted test methods for thermal interface materials
Author :
Lasance, Clemens J M
Author_Institution :
Philips Res. Labs., Eindhoven, Netherlands
Abstract :
It is increasingly realised that the status of measuring the thermal properties of thermal interface materials (TIMs) and the proliferation of these data cause much irritation to vendors and users alike. This paper discusses the various problems underlying the status quo and offers a strategy to overcome the problems in due time. In particular, the discussion focuses on various standardisation aspects and application-specific measurements.
Keywords :
cooling; materials testing; measurement standards; thermal management (packaging); thermal resistance measurement; TIM thermal properties measurement; heat transfer; interface thermal resistance; measurement standards; package thermal resistance; semiconductor package heat dissipation; thermal interface material test methods; Contact resistance; Costs; Electrical resistance measurement; Heat sinks; Materials testing; Measurement standards; Packaging; Resistance heating; Semiconductor materials; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
Print_ISBN :
0-7803-7793-1
DOI :
10.1109/STHERM.2003.1194349
