DocumentCode
3389067
Title
Influence of water on PE — SiO2 nanocomposites dielectric properties
Author
Couderc, H. ; David, E. ; Frechette, Michel ; Medjdoub, A.
Author_Institution
Ecole de Technol. Super., Montreal, QC, Canada
fYear
2013
fDate
20-23 Oct. 2013
Firstpage
737
Lastpage
741
Abstract
Polymers filled with inorganic nanoparticles have been extensively investigated in recent years because of their improved mechanical and electrical properties compared with the unfilled polymers. The most commonly used inorganic particles are oxides, particularly silica, because of their good properties and low cost. However, oxides have a hydrophilic nature, which leads to presence of water at the interface between particles and matrix. Due to the predominance of the particle-matrix interfaces in the case of nanocomposites, the presence of water in the interlayer region can become problematic. Moreover, the hydrophobic nature of most polymers, particularly polyolefins such as polyethylene, may make difficult the movement of this interfacial water. In this paper, dielectric spectroscopy was used during drying isothermal treatment at 80°C. The Maxwell - Wagner - Sillars relaxation peak sharpens and shifts to lower frequencies by three decades with time, translating into a modification of the interface between silica and polyethylene by drying.
Keywords
dielectric materials; dielectric properties; filled polymers; hydrophilicity; hydrophobicity; nanocomposites; polyethylene insulation; silicon compounds; water; Maxwell-Wagner-Sillars relaxation peak; PE; SiO2; dielectric spectroscopy; electrical properties; hydrophilic nature; inorganic nanoparticles; inorganic particles; interlayer region; mechanical properties; nanocomposites dielectric properties; oxides; particle-matrix interfaces; polyethylene; polymers; polyolefins; silica; temperature 80 C; water; Dielectrics; Nanocomposites; Nanoparticles; Plastics; Polyethylene; Silicon compounds; Time-frequency analysis; Broadband Dielectric Spectroscopy; Nanocomposites; Silica;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2013 IEEE Conference on
Conference_Location
Shenzhen
Type
conf
DOI
10.1109/CEIDP.2013.6748159
Filename
6748159
Link To Document