DocumentCode
3389089
Title
Experimental and numerical simulation study of heat sinks with impingement flow at high Reynolds numbers
Author
Reddy, A. Venugopal
Author_Institution
Intel Corp., Folsom, CA, USA
fYear
2003
fDate
11-13 March 2003
Firstpage
176
Lastpage
178
Abstract
The heat transfer in confined air jet cooling for electronic cooling applications is studied experimentally and through simulations. Copper and aluminum heat sinks are studied at various air-flow rates. The case to ambient thermal resistance of the copper heat sink varied from 0.38-0.23°C/W (the Reynolds number varied from 45,000-105,000). The simulations predicted a higher thermal resistance, however the predicted resistance trend matched the experimental trend. The experimental thermal resistance of the aluminum heat sink varied from 0.48-0.34°C/W (the Reynolds number varied from 45,000-90,000). The resistance trend for both the copper and aluminum heat sinks indicates that the reduction in thermal resistance would be minimal with further increase in flow rate. Simulation results show that these heat sinks can be further optimized by varying the number and spacing of the pin fins.
Keywords
aluminium; confined flow; cooling; copper; heat sinks; jets; optimisation; thermal resistance; Al; Cu; air-flow rate; aluminum heat sinks; confined air jet cooling; copper heat sinks; electronic cooling; heat sink optimization; heat transfer; high Reynolds number impingement flow; pin fins number/spacing; thermal resistance; Aluminum; Copper; Electronics cooling; Heat sinks; Heat transfer; Numerical simulation; Orifices; Resistance heating; Temperature; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
ISSN
1065-2221
Print_ISBN
0-7803-7793-1
Type
conf
DOI
10.1109/STHERM.2003.1194358
Filename
1194358
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