• DocumentCode
    3389089
  • Title

    Experimental and numerical simulation study of heat sinks with impingement flow at high Reynolds numbers

  • Author

    Reddy, A. Venugopal

  • Author_Institution
    Intel Corp., Folsom, CA, USA
  • fYear
    2003
  • fDate
    11-13 March 2003
  • Firstpage
    176
  • Lastpage
    178
  • Abstract
    The heat transfer in confined air jet cooling for electronic cooling applications is studied experimentally and through simulations. Copper and aluminum heat sinks are studied at various air-flow rates. The case to ambient thermal resistance of the copper heat sink varied from 0.38-0.23°C/W (the Reynolds number varied from 45,000-105,000). The simulations predicted a higher thermal resistance, however the predicted resistance trend matched the experimental trend. The experimental thermal resistance of the aluminum heat sink varied from 0.48-0.34°C/W (the Reynolds number varied from 45,000-90,000). The resistance trend for both the copper and aluminum heat sinks indicates that the reduction in thermal resistance would be minimal with further increase in flow rate. Simulation results show that these heat sinks can be further optimized by varying the number and spacing of the pin fins.
  • Keywords
    aluminium; confined flow; cooling; copper; heat sinks; jets; optimisation; thermal resistance; Al; Cu; air-flow rate; aluminum heat sinks; confined air jet cooling; copper heat sinks; electronic cooling; heat sink optimization; heat transfer; high Reynolds number impingement flow; pin fins number/spacing; thermal resistance; Aluminum; Copper; Electronics cooling; Heat sinks; Heat transfer; Numerical simulation; Orifices; Resistance heating; Temperature; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-7793-1
  • Type

    conf

  • DOI
    10.1109/STHERM.2003.1194358
  • Filename
    1194358