Measurement of vapor chamber performance [heatsink applications]

Author

Wei, Jie ; Chan, Albert ; Copeland, David

Author_Institution

Corporate Manuf. Syst. Eng. Group, Fujitsu Ltd., Kawasaki, Japan

fYear

2003

fDate

11-13 March 2003

Firstpage

191

Lastpage

194

Abstract

The thermal behavior of a vapor chamber with water as the working fluid and sintered metal particles for a wick structure has been experimentally determined. Results are provided in two formats - as traditional heat flux versus temperature difference (due to boiling) and as film coefficient versus heat flux. Results show that the film coefficient increases with heat flux in an approximately linear trend. The critical heat flux has not been determined due to equipment limitations. The maximum heat flux measured is 80 W/cm². An example case study is included to illustrate the use of correlated results to estimate vapor chamber heatsink performance, as well as to compare with the performance of metal based heatsinks.

Keywords

boiling; cooling; heat sinks; thermal resistance; thermal variables measurement; boiling; cooling; film coefficient versus heat flux; heat flux versus temperature difference; heat transfer rate; metal base heatsinks; sintered metal particle wick structure; thermal resistance; vapor chamber heatsink; vapor chamber performance measurement; water working fluid; Aluminum; Copper; Heat sinks; Laboratories; Manufacturing systems; Microprocessors; Power dissipation; Systems engineering and theory; Temperature; Water heating;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE

ISSN

1065-2221

Print_ISBN

0-7803-7793-1

Type

conf

DOI

10.1109/STHERM.2003.1194361

Filename

1194361