DocumentCode
3389331
Title
Non-linearity issues in the dynamic compact model generation [package thermal modeling]
Author
Rencz, Marta ; Szekely, Vladimir
Author_Institution
MicReD Ltd., Budapest, Hungary
fYear
2003
fDate
11-13 March 2003
Firstpage
263
Lastpage
270
Abstract
The dynamic compact thermal Rth-Cth (RC) models of packages generated from the transient measurements or simulations are usually temperature independent, that is linear. This is theoretically erroneous. In this paper we show how to generate nonlinear compact thermal models. Algorithms with which network simulators can simulate nonlinear Rth and Cth elements are also given. With the help of the generated correct nonlinear models of packages, we present various experiments in which the order of magnitude of the error, caused by neglecting the temperature dependence of the Rth and Cth elements of the dynamic compact thermal models is checked.
Keywords
RC circuits; nonlinear network analysis; thermal analysis; thermal management (packaging); dynamic compact thermal model generation; electrical RC elements; nonlinear element network simulators; package thermal behavior; package thermal modeling; temperature dependence; thermal model nonlinearities; Circuit simulation; Conducting materials; Electronic packaging thermal management; Error correction; Linearity; Nonlinear circuits; Temperature dependence; Temperature distribution; Temperature sensors; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
ISSN
1065-2221
Print_ISBN
0-7803-7793-1
Type
conf
DOI
10.1109/STHERM.2003.1194372
Filename
1194372
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