• DocumentCode
    3389331
  • Title

    Non-linearity issues in the dynamic compact model generation [package thermal modeling]

  • Author

    Rencz, Marta ; Szekely, Vladimir

  • Author_Institution
    MicReD Ltd., Budapest, Hungary
  • fYear
    2003
  • fDate
    11-13 March 2003
  • Firstpage
    263
  • Lastpage
    270
  • Abstract
    The dynamic compact thermal Rth-Cth (RC) models of packages generated from the transient measurements or simulations are usually temperature independent, that is linear. This is theoretically erroneous. In this paper we show how to generate nonlinear compact thermal models. Algorithms with which network simulators can simulate nonlinear Rth and Cth elements are also given. With the help of the generated correct nonlinear models of packages, we present various experiments in which the order of magnitude of the error, caused by neglecting the temperature dependence of the Rth and Cth elements of the dynamic compact thermal models is checked.
  • Keywords
    RC circuits; nonlinear network analysis; thermal analysis; thermal management (packaging); dynamic compact thermal model generation; electrical RC elements; nonlinear element network simulators; package thermal behavior; package thermal modeling; temperature dependence; thermal model nonlinearities; Circuit simulation; Conducting materials; Electronic packaging thermal management; Error correction; Linearity; Nonlinear circuits; Temperature dependence; Temperature distribution; Temperature sensors; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-7793-1
  • Type

    conf

  • DOI
    10.1109/STHERM.2003.1194372
  • Filename
    1194372