Title :
Simulating the dynamic electro-thermal behavior of power electronic circuits and systems
Author :
Hefner, Allen R. ; Blackburn, David L.
Author_Institution :
Semicond. Electron. Div., Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
Abstract :
A methodology is presented for simulating the dynamic electrothermal behavior of power electronic circuits and systems. In the approach described, the simulator simultaneously solves for the temperature distribution within the semiconductor devices, packages, and heat sinks (thermal network) along with the currents and voltages within the electrical network. The thermal network is then coupled to the electrical network through the electrothermal models for the semiconductor devices.
Keywords :
circuit analysis computing; digital simulation; heat sinks; packaging; power electronics; semiconductor device models; temperature distribution; thermal analysis; circuit analysis computing; digital simulation; dynamic electrothermal behavior; heat sinks; packaging; power electronic circuits; semiconductor devices; temperature distribution; thermal analysis; Circuit simulation; Circuits and systems; Electronic packaging thermal management; Electrothermal effects; Heat sinks; Power electronics; Resistance heating; Semiconductor device packaging; Semiconductor devices; Temperature distribution;
Conference_Titel :
Computers in Power Electronics, 1992., IEEE Workshop on
Conference_Location :
Berkeley, CA, USA
Print_ISBN :
0-7803-0920-0
DOI :
10.1109/CIPE.1992.247284
