A comparative study of two simulation methods for thermal analysis of power electronic devices

Author

Napieralski, Andrzej ; Skorek, Adam ; Dorkel, Jean-Marie

Author_Institution

Lab. d´´Autom. et d´´Analyse des Syst., CNRS, Toulouse, France

fYear

1992

fDate

1992

Firstpage

129

Lastpage

142

Abstract

The authors compare two methods applied to 3D temperature map computation of power hybrid circuits. The first is the conventional FE method, and the second, so-called thermal influence coefficient method (TIC), is a specific procedure devised for fast temperature computations of hybrid power circuits. The numerical methods designed for true 3D thermal analyses have been implemented in programs running on PC-AT microcomputers.

Keywords

circuit analysis computing; digital simulation; finite element analysis; microcomputer applications; power electronics; semiconductor device models; temperature distribution; thermal analysis; 3D temperature map; FEM; PC-AT microcomputers; circuit analysis computing; digital simulation; numerical methods; power electronic devices; power hybrid circuits; semiconductor device models; thermal analysis; thermal influence coefficient method; Analytical models; Circuit simulation; Computational modeling; Data processing; Design methodology; Displays; Iron; Optical computing; Packaging; Process design;

fLanguage

English

Publisher

ieee

Conference_Titel

Computers in Power Electronics, 1992., IEEE Workshop on

Conference_Location

Berkeley, CA, USA

Print_ISBN

0-7803-0920-0

Type

conf

DOI

10.1109/CIPE.1992.247285

Filename

247285