Using compact models in the early thermal design of electronics

Author

Eggink, H.J. ; Janssen, G.M. ; Janssen, J.H.J.

Author_Institution

Philips Centre for Ind. Technol., Eindhoven, Netherlands

fYear

2003

fDate

11-13 March 2003

Firstpage

319

Lastpage

323

Abstract

This paper gives a description of how boundary condition independent (BCI) or compact models can be used in early estimates of component temperatures. For this purpose a spreadsheet program is made, named COMIC, the functionality of which is described and demonstrated. The limitations of compact models and COMIC are addressed. The combination of COMIC and compact models makes the use of classical metrics no longer necessary.

Keywords

circuit simulation; heat transfer; integrated circuit modelling; printed circuit design; spreadsheet programs; thermal management (packaging); BCI models; COMIC spreadsheet program; PCB design; boundary condition independent models; compact thermal models; component temperature estimation; electronics thermal design; heat transfer coefficients; Boundary conditions; Heat transfer; Packaging; Printed circuits; Process design; Production; Spreadsheet programs; Temperature; Testing; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE

ISSN

1065-2221

Print_ISBN

0-7803-7793-1

Type

conf

DOI

10.1109/STHERM.2003.1194379

Filename

1194379

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3389469