Title :
Using compact models in the early thermal design of electronics
Author :
Eggink, H.J. ; Janssen, G.M. ; Janssen, J.H.J.
Author_Institution :
Philips Centre for Ind. Technol., Eindhoven, Netherlands
Abstract :
This paper gives a description of how boundary condition independent (BCI) or compact models can be used in early estimates of component temperatures. For this purpose a spreadsheet program is made, named COMIC, the functionality of which is described and demonstrated. The limitations of compact models and COMIC are addressed. The combination of COMIC and compact models makes the use of classical metrics no longer necessary.
Keywords :
circuit simulation; heat transfer; integrated circuit modelling; printed circuit design; spreadsheet programs; thermal management (packaging); BCI models; COMIC spreadsheet program; PCB design; boundary condition independent models; compact thermal models; component temperature estimation; electronics thermal design; heat transfer coefficients; Boundary conditions; Heat transfer; Packaging; Printed circuits; Process design; Production; Spreadsheet programs; Temperature; Testing; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2003. Ninteenth Annual IEEE
Print_ISBN :
0-7803-7793-1
DOI :
10.1109/STHERM.2003.1194379
