DocumentCode :
3389817
Title :
Gate tunable resonant tunneling in graphene-based heterostructures and device applications
Author :
Tutuc, E. ; Fallahazad, B. ; Kang, S. ; Lee, K. ; Kim, K. ; Movva, H.C.P. ; Mou, X. ; Corbet, C.M. ; Register, L.F. ; Banerjee, S.K. ; Taniguchi, T. ; Watanabe, K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Texas at Austin, Austin, TX, USA
fYear :
2015
fDate :
21-24 June 2015
Firstpage :
269
Lastpage :
270
Abstract :
Electron tunneling is receiving increased emphasis as the physical mechanism of operation in emerging devices that seek to mitigate power dissipation issues in aggressively scaled CMOS technology. A tunneling field-effect transistors (TFET) consisting of a gated p-i-n junction is arguably the best known example. In a separate class of tunneling devices, consisting of two semiconducting layers separated by a barrier, the inter-layer tunneling current-voltage characteristics possess gate-tunable negative differential resistance [1]-[3], which is subsequently used to implement Boolean logic functions [4]. We describe here the fabrication, characterization, and benchmarking of inter-layer TFETs (ITFETs) using double bilayer graphene heterostructures separated by hexagonal boron-nitride dielectric as example [Fig. 1(a)].
Keywords :
field effect transistors; graphene devices; resonant tunnelling transistors; Boolean logic functions; ITFET; aggressively scaled CMOS technology; double bilayer graphene heterostructures; electron tunneling; gate tunable resonant tunneling; gate-tunable negative differential resistance; gated p-i-n junction; hexagonal boron-nitride dielectric; inter-layer TFET; inter-layer tunneling current-voltage characteristics; physical mechanism; power dissipation issues; semiconducting layers; tunneling devices; tunneling field-effect transistors; Dielectrics; Graphene; Logic gates; Resistance; Resonant tunneling devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference (DRC), 2015 73rd Annual
Conference_Location :
Columbus, OH
Print_ISBN :
978-1-4673-8134-5
Type :
conf
DOI :
10.1109/DRC.2015.7175677
Filename :
7175677
Link To Document :
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