• DocumentCode
    3389979
  • Title

    In-Situ Thermal Response Test for Closed-Loop Vertical Ground Heat Exchanger in Shanghai, China

  • Author

    Chen, Shuai

  • Author_Institution
    Coll. of Mech. Eng., Shanghai Univ. of Eng. Sci., Shanghai, China
  • fYear
    2012
  • fDate
    27-29 March 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Ground source heat pump (GSHP) systems exchange heat with the ground, often through a closed-loop, vertical, borehole heat exchanger (BHE). The performance of the BHE depends on the thermal properties of the ground formation, as well as soil or backfill in the borehole. The design and economic probability of GSHP systems need the thermal conductivity of geological structure and thermal resistance of BHE. Thermal response test (TRT) method allows the in-situ determination of the thermal conductivity (λ) of the ground formation in the vicinity of a BHE, as well as the effective thermal resistance (Rb) of this latter. Thermal properties measured in laboratory experiments do not comply with data of in-situ conditions. The present article describes the results of thermal properties of the BHE whose depth is 80m in Qingpu District, Shanghai, China. As shown in these results, λ and Rb of borehole are determined as 1.97 W·m-1·K-1and 0.129 (m·K·W-1) respectively.
  • Keywords
    design engineering; ground source heat pumps; heat exchangers; mechanical testing; probability; thermal conductivity; thermal properties; thermal resistance; BHE; China; GSHP system; TRT method; borehole heat exchanger; closed-loop vertical ground heat exchanger; economic probability; geological structure; ground source heat pump system; in-situ thermal response test; size 80 m; thermal conductivity; thermal resistance; thermal response test method; Conductivity; Heat pumps; Land surface temperature; Temperature measurement; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power and Energy Engineering Conference (APPEEC), 2012 Asia-Pacific
  • Conference_Location
    Shanghai
  • ISSN
    2157-4839
  • Print_ISBN
    978-1-4577-0545-8
  • Type

    conf

  • DOI
    10.1109/APPEEC.2012.6307205
  • Filename
    6307205