Application of laser cutting and linking technology for restructuring interconnections in microelectronic devices

In the present research, the laser linking and cutting of the metallization lines has been studied both numerically and experimentally. The laser cutting of metal lines proceeds by an ablation/melting process. The metal typically has a high reflectivity, so much of the incident laser energy is lost. The remaining energy is absorbed in the first few hundred Angstroms, with the metal acting as a surface heat source. This energy quickly diffuses through the rest of the metal line, causing either vaporization or melting of the line, depending on the amount of energy absorbed. Two typical metal lines are considered: aluminum with 0.5% Si and with 1% Cu.