Title :
An ISM band CMOS integrated wireless telemetry transceiver (in a 0.18 μm copper CMOS process)
Author :
Kim, Jonghae ; Harjani, Ramesh
Author_Institution :
Minnesota Univ., Minneapolis, MN, USA
Abstract :
A 900 MHz CMOS BFSK transceiver is used as a test vehicle to evaluate the impact of copper interconnect on CMOS RF circuit performance. The RF front-end contains spiral inductors and fractal capacitors, whose parasitics degrade the receiver sensitivity. It is shown that spiral inductor quality factors (Qs) are on average 70 % higher when copper interconnect is used in place of aluminum, while capacitor Qs are also improved significantly. As a result, the front-end receiver gain is increased by nearly 4 dB and the receiver noise figure is reduced by more than 1 dB when copper is used instead of aluminum. The 20 mW transceiver fabricated in the 0.18 μm copper UMC process can achieve a 0.1 % BER for a -98 dBm input, while operating at 200 kb/s data. The maximum power output of transmit section is +10 dBm
Keywords :
CMOS digital integrated circuits; Q-factor; UHF integrated circuits; capacitors; inductors; integrated circuit interconnections; radiotelemetry; transceivers; 0.18 micron; 200 kbit/s; 900 MHz; BER; BFSK transceiver; CMOS RF circuit performance; CMOS integrated wireless telemetry transceiver; Cu; ISM band; RF front-end; UMC process; copper CMOS process; copper interconnect; fractal capacitors; front-end receiver gain; maximum power output; quality factors; receiver noise figure; receiver sensitivity; spiral inductors; Aluminum; Capacitors; Circuit testing; Copper; Inductors; Integrated circuit interconnections; Radio frequency; Spirals; Telemetry; Transceivers;
Conference_Titel :
Vehicular Technology Conference, 2001. VTC 2001 Spring. IEEE VTS 53rd
Conference_Location :
Rhodes
Print_ISBN :
0-7803-6728-6
DOI :
10.1109/VETECS.2001.944114
