An overview of thermal management for next generation microelectronic devices

Author

Tonapi, S.S. ; Fillion, R.A. ; Schattenmann, F.J. ; Cole, H.S. ; Evans, J.D. ; Sammakia, B.G.

Author_Institution

Gen. Electr. Global Res., Niskayuna, NY, USA

fYear

2003

fDate

31 March-1 April 2003

Firstpage

250

Lastpage

254

Abstract

The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics and is also addressed in this paper.

Keywords

consumer electronics; thermal management (packaging); aerospace electronics; complex high-end system; consumer electronics; electronic packaging; microelectronic device; thermal interface material; thermal management; Aerospace materials; Costs; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Microelectronics; Power dissipation; Power system management; Thermal management; Thermal management of electronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference and Workshop, 2003 IEEEI/SEMI

ISSN

1078-8743

Print_ISBN

0-7803-7681-1

Type

conf

DOI

10.1109/ASMC.2003.1194502

Filename

1194502

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3390639