An effective methodology for improving equipment reliability and reducing excursions during a factory ramp

This paper describes the continuous improvement methodology that was developed and used in the Cu CMP area of Intel´s Fab 20 during the 0.13 μm logic technology production ramp from July 2001 through Sept. 2002. Significant and lasting improvements were realized by the systematic application of manufacturing engineering principles. Although many technical process changes were made as a result of these activities, the main focus of the paper is the methodology employed and a reflection on the effectiveness of the key elements of overall effort.