Impacts of windowed backing layer on write-to-read coupling on suspension interconnection

Author

Prachumrasee, K. ; Swatdiponphallop, S. ; Sivaratana, R. ; Chankum, N. ; Ung, L. ; Siritaratiwat, A.

Author_Institution

Dept. of Electr. Eng., Khon Kaen Univ., Khon Kaen

fYear

2009

fDate

14-16 Jan. 2009

Firstpage

1

Lastpage

2

Abstract

The effect of backing layer windowing on write-to-read coupling based on s-parameter analysis by using 3D simulation tool is studied. The two different windowed structure patterns of TSA interconnection are compared to observe the transmission coefficient of write-to-read coupling. From simulation results, it is found that the windowed structure in the middle of the backing layer shows smaller transmission coefficient than that at lateral of the backing layer.

Keywords

S-parameters; disc drives; hard discs; 3D simulation tool; HDD; hard disk drive components; s-parameter analysis; suspension interconnection; trace suspension assembly; transmission coefficient; windowed backing layer; windowed structure patterns; write-to-read coupling; Analytical models; Assembly; Copper; Couplings; Crosstalk; Disk recording; Integrated circuit interconnections; Magnetic heads; Scattering parameters; Voltage; Recording head; TSA interconnection; Windowed structure; Write-to-read coupling;

fLanguage

English

Publisher

ieee

Conference_Titel

Magnetic Recording Conference, 2009. APMRC '09. Asia-Pacific

Conference_Location

Singapore

Print_ISBN

978-9810-82191-3

Type

conf

DOI

10.1109/APMRC.2009.4925414

Filename

4925414