• DocumentCode
    3392817
  • Title

    Modeling and scheduling for semiconductor wafer fabrication systems

  • Author

    Zhifang, Shao ; Yu, Chen

  • Author_Institution
    Sch. of Inf. Manage. & Eng., Shanghai Univ. of Finance & Econ., Shanghai
  • fYear
    2008
  • fDate
    10-12 Oct. 2008
  • Firstpage
    1177
  • Lastpage
    1182
  • Abstract
    Two methods were presented to model the semiconductor wafer fabrication system and an AI based search was introduced for the scheduling. First, resource based Petri net was defined to model the structure of the system so that the net will not expanded rapidly with the process going on. Then, a modeling method which integrated IDEF0 with Petri net was given to character the function of system, which can describe the function of the system and sub-system and the relationships among them at length. Based on the model, ant colony optimization algorithm (ACO) was introduced to find the optimization schedule. A semiconductor manufacturing model with six-machine five-step from Intel was used here as an example, which shows exciting results in reduced the manufacturing cycle time and so on.
  • Keywords
    Petri nets; artificial intelligence; integrated circuit manufacture; integrated circuit modelling; optimisation; scheduling; search problems; AI based search; ant colony optimization algorithm; integrated IDEF0; resource based Petri net; semiconductor manufacturing model; semiconductor wafer fabrication systems; Artificial intelligence; Fabrication; Flexible manufacturing systems; Job shop scheduling; Optimal scheduling; Production systems; Scheduling algorithm; Semiconductor device manufacture; Semiconductor device modeling; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System Simulation and Scientific Computing, 2008. ICSC 2008. Asia Simulation Conference - 7th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-1786-5
  • Electronic_ISBN
    978-1-4244-1787-2
  • Type

    conf

  • DOI
    10.1109/ASC-ICSC.2008.4675545
  • Filename
    4675545