Title :
Coupled simulation of circuit and piezoelectric laminates
Author :
Xu, Cheng-Gang ; Fiez, Terri ; Mayaram, Kartikeya
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Abstract :
In this paper, an algorithm for the coupled simulation of circuit and piezoelectric laminate devices is presented. A finite element solver for piezoelectric laminates is included in the SPICE framework as a capacitor. The charge of this capacitor is a function of both the terminal voltage and the mechanical strain in the piezoelectric material. The coupled simulator allows simulation of novel micro power generation circuits based on piezoelectric laminates.
Keywords :
capacitors; circuit simulation; finite element analysis; laminates; piezoelectric devices; piezoelectric materials; SPICE framework; capacitor; circuit devices; coupled simulation; coupled simulator; finite element solver; mechanical strain; micro power generation circuits; piezoelectric laminate devices; piezoelectric material; terminal voltage; Capacitive sensors; Capacitors; Circuit simulation; Coupling circuits; Finite element methods; Laminates; Piezoelectric devices; Piezoelectric materials; SPICE; Voltage;
Conference_Titel :
Quality Electronic Design, 2003. Proceedings. Fourth International Symposium on
Print_ISBN :
0-7695-1881-8
DOI :
10.1109/ISQED.2003.1194760
