• DocumentCode
    3394913
  • Title

    Multigranular simulation of heterogeneous embedded systems

  • Author

    Agrawal, Aditya ; Ledeczi, Akos

  • Author_Institution
    Inst. for Software Integrated Syst., Vanderbilt Univ., Nashville, TN, USA
  • fYear
    2003
  • fDate
    7-10 April 2003
  • Firstpage
    3
  • Lastpage
    10
  • Abstract
    Heterogeneous embedded systems, where configurable or application specific hardware devices (FPGAs and ASICs) are used alongside traditional processors, are becoming more and more widely used. To facilitate rapid design and development of such heterogeneous hardware/software systems, it is essential to expand the software design cycle to integrate hardware modeling and simulation. Co-simulation and exploration of the joint design space are key problems. To design, develop and verify such systems, different kinds of simulations at various levels of granularity are required The hardware modeling and simulation framework of the Model-Based Integrated Simulation Framework (MILAN) integrates these requirements into a single powerful design, development and simulation environment.
  • Keywords
    embedded systems; field programmable gate arrays; hardware-software codesign; software engineering; virtual machines; ASICs; FPGAs; Model-Based Integrated Simulation Framework; application specific hardware devices; co-simulation; configurable hardware devices; granularity; hardware modeling; hardware simulation; heterogeneous embedded systems; heterogeneous hardware-software systems; joint design space; multigranular simulation; processors; rapid design; rapid development; software design cycle; Application software; Computer interfaces; Embedded software; Embedded system; Field programmable gate arrays; Hardware; Power system modeling; Software design; Software systems; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering of Computer-Based Systems, 2003. Proceedings. 10th IEEE International Conference and Workshop on the
  • Print_ISBN
    0-7695-1917-2
  • Type

    conf

  • DOI
    10.1109/ECBS.2003.1194776
  • Filename
    1194776