Title :
Enclosure method for reconstruction of 2-D cracks
Author :
Wei Sun ; Tian Luan
Author_Institution :
Dept. Appl. Sci., Harbin Univ. of Sci. & Technol., Harbin, China
Abstract :
In this paper, we discuss the reconstruction of cracks which are segments in a planar conductoran inverse geometry problem of Laplace equation. The singular behavior at the tip of cracks is investigated. Enclosure method is proposed to detect surface cracks and interior cracks. Also we developed an algorithm to locate cracks with an angle.
Keywords :
Laplace equations; crack detection; surface cracks; 2-d cracks reconstruction; Laplace equation; cracks inspection; enclosure method; inverse geometry problem; planar conductor; surface cracks; Algorithm design and analysis; Conductors; Electric potential; Electrostatic measurements; Inspection; Inverse problems; Surface cracks; Green formulation; enclosure method; inverse problem; laplace equation;
Conference_Titel :
Mechatronic Science, Electric Engineering and Computer (MEC), 2011 International Conference on
Conference_Location :
Jilin
Print_ISBN :
978-1-61284-719-1
DOI :
10.1109/MEC.2011.6025752
