• DocumentCode
    3395213
  • Title

    Automatic defect classification: A productivity improvement tool

  • Author

    Esposito, Tony ; Burns, Mark ; Morell, Scott ; Wang, Eric

  • Author_Institution
    IBM Corp., Essex Junction, VT, USA
  • fYear
    1997
  • fDate
    10-12 Sep 1997
  • Firstpage
    269
  • Lastpage
    276
  • Abstract
    The goal of this paper is to demonstrate a quantitative methodology for evaluating the effect that various in-line monitoring strategies have on the cost of defect excursions. An in-line monitoring case study using the IMPACT ADC from KLA-Tencor is the vehicle for demonstrating this data-driven methodology. Data was collected for this case study from wafers processed on a 64 Mb fabrication technology during a beta evaluation of IMPACT ADC at IBM Burlington. The overall benefit of an in-line monitor strategy that includes on-line ADC will be compared and proven superior to traditional line monitor strategies that include manual defect classification. Key advantages of on-line ADC that reduce the cost of excursions are high accuracy and a decrease in the overall time-to-results. Some qualitative factors such as operator skill level and training requirements will also be discussed
  • Keywords
    automatic optical inspection; human resource management; integrated circuit manufacture; 64 Mbit; IC fabrication technology; KLA-Tencor; automatic defect classification; beta evaluation; excursion cost; in-line monitoring; on-line IMPACT ADC; operator training; productivity; wafer inspection; Costs; Data analysis; Fabrication; Humans; Inspection; Manufacturing processes; Monitoring; Productivity; Semiconductor device manufacture; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 1997. IEEE/SEMI
  • Conference_Location
    Cambridge, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-4050-7
  • Type

    conf

  • DOI
    10.1109/ASMC.1997.630747
  • Filename
    630747