DocumentCode
3395213
Title
Automatic defect classification: A productivity improvement tool
Author
Esposito, Tony ; Burns, Mark ; Morell, Scott ; Wang, Eric
Author_Institution
IBM Corp., Essex Junction, VT, USA
fYear
1997
fDate
10-12 Sep 1997
Firstpage
269
Lastpage
276
Abstract
The goal of this paper is to demonstrate a quantitative methodology for evaluating the effect that various in-line monitoring strategies have on the cost of defect excursions. An in-line monitoring case study using the IMPACT ADC from KLA-Tencor is the vehicle for demonstrating this data-driven methodology. Data was collected for this case study from wafers processed on a 64 Mb fabrication technology during a beta evaluation of IMPACT ADC at IBM Burlington. The overall benefit of an in-line monitor strategy that includes on-line ADC will be compared and proven superior to traditional line monitor strategies that include manual defect classification. Key advantages of on-line ADC that reduce the cost of excursions are high accuracy and a decrease in the overall time-to-results. Some qualitative factors such as operator skill level and training requirements will also be discussed
Keywords
automatic optical inspection; human resource management; integrated circuit manufacture; 64 Mbit; IC fabrication technology; KLA-Tencor; automatic defect classification; beta evaluation; excursion cost; in-line monitoring; on-line IMPACT ADC; operator training; productivity; wafer inspection; Costs; Data analysis; Fabrication; Humans; Inspection; Manufacturing processes; Monitoring; Productivity; Semiconductor device manufacture; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 1997. IEEE/SEMI
Conference_Location
Cambridge, MA
ISSN
1078-8743
Print_ISBN
0-7803-4050-7
Type
conf
DOI
10.1109/ASMC.1997.630747
Filename
630747
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