Title :
Coarse grained molecular dynamics simulation of thermosetting resins in nanocomposite
Author :
Sawa, Fumio ; Imai, Takahiro ; Ozaki, Tamon ; Shimizu, Toshio ; Tanaka, Toshikatsu
Author_Institution :
Power & Ind. Syst. R&D Center, Toshiba Corp., Yokohama, Japan
Abstract :
Epoxy-based polymer nanocomposites are promising materials for high voltage insulation in industrial use because they have advantages in some properties such as thermal resistivity, mechanical toughness and good V-t characteristics. In polymer nanocomposites, interfaces between fillers and polymer matrices are considered to play a predominant role because they have much larger interface areas than in microcomposites. The coarse-grained molecular dynamics simulation, based on the bead-spring model in polymer physics, is a powerful tool for interpreting the morphology and dynamics of polymer chains. In this study, a coarse-grained molecular dynamics simulation including a reaction model of monomers such as chief ingredients and hardener was conducted to investigate the thermodynamic properties of the interface between nano-fillers and thermosetting resins. Simulation results indicate that the dynamics of network chains close to the nano-filler surfaces is different from the bulk regions. This result will give in-depth analysis of interfacial problems of nano-composites.
Keywords :
epoxy insulation; filled polymers; molecular dynamics method; nanocomposites; V-t characteristics; bead-spring model; coarse grained molecular dynamics simulation; epoxy-based polymer nanocomposites; high voltage insulation; mechanical toughness; monomers; nanofillers; polymer chains; thermal resistivity; thermosetting resins; Conductivity; Mechanical factors; Nanostructured materials; Physics; Plastic insulation; Plastics industry; Polymers; Resins; Thermal resistance; Voltage; Coarse-grained molecular dynamics simulation; Polymer nanocomposites; Thermosetting resin;
Conference_Titel :
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-4367-3
Electronic_ISBN :
978-1-4244-4368-0
DOI :
10.1109/ICPADM.2009.5252214