• DocumentCode
    3395322
  • Title

    Nano-clay and micro-silica mixed composites for insulating materials for environmentally-conscious switchgear

  • Author

    Ozaki, Tamon ; Komiya, Gen ; Murayama, Kiyoko ; Imai, Takahiro ; Sawa, Fumio ; Shimizu, Toshio ; Harada, Miyuki ; Ochi, Mitsukazu ; Ohki, Yoshimichi ; Tanaka, Toshikatsu

  • Author_Institution
    Power & Ind. Syst. R&D Center, Toshiba Corp., Fuchu, Japan
  • fYear
    2009
  • fDate
    19-23 July 2009
  • Firstpage
    864
  • Lastpage
    867
  • Abstract
    Nano-clay and micro-silica mixed composites were made for use as insulating materials for switchgear. Observation of nano-clay dispersion and measurements of insulation breakdown properties under a homogeneous electric field were conducted of these composites. Moreover, simulations were carried out to estimate the curing reaction and rheological behavior of the composite in an automatic pressure gelation system. Experimental results demonstrated that these composites have suitable material characteristics for practical use in switchgear.
  • Keywords
    electric breakdown; insulating materials; nanocomposites; switchgear insulation; automatic pressure gelation system; curing reaction estimation; environmentally-conscious switchgear; homogeneous electric field; insulating material; insulation breakdown properties measurement; microsilica mixed composites; nanoclay composite; nanoclay dispersion; simulation; Composite materials; Conducting materials; Curing; Dielectric materials; Dielectrics and electrical insulation; Epoxy resins; Gas insulation; Research and development; Solids; Switchgear; insulation breakdown; nanocomposite; reaction kinetics; rheological characteristics; simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-4367-3
  • Electronic_ISBN
    978-1-4244-4368-0
  • Type

    conf

  • DOI
    10.1109/ICPADM.2009.5252223
  • Filename
    5252223