Abstract :
The following topics were dealt with: power integrity; signal integrity; EM modeling; electromagnetic band gap; power delivery network; wireless serial data communication; electromagnetic interference; cavity resonators; ESR controller; power distribution network; FCPBGA; chip-to-chip interconnect; finite element method.
Keywords :
cavity resonators; chip scale packaging; electromagnetic interference; electronics packaging; finite element analysis; photonic band gap; EM modeling; ESR controller; FCPBGA; cavity resonators; chip-to-chip interconnect; electromagnetic band gap; electromagnetic interference; electronic packaging; finite element method; power delivery network; power distribution network; power integrity; signal integrity; wireless serial data communication;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
DOI :
10.1109/EPEP.2008.4675859
