• DocumentCode
    3395568
  • Title

    Statistical link analysis of high-speed memory I/O interfaces during simultaneous switching events

  • Author

    Ren, Jihong ; Oh, Dan ; Chang, Sam ; Lambrecht, Frank

  • Author_Institution
    Rambus Inc., Los Altos, CA
  • fYear
    2008
  • fDate
    27-29 Oct. 2008
  • Firstpage
    25
  • Lastpage
    28
  • Abstract
    Single-ended signaling systems, popular in memory I/O interfaces, are limited by signal and power integrity issues such as crosstalk and simultaneous switching output noise (SSO). At high data rates, the single-ended systems also suffers from random noise and timing jitter. In this paper, we present an integrated signal and power integrity simulation flow that combines statistical and transient simulation methods to enable the characterization of single-ended systems to account for random timing jitter in addition to the traditional SI issues focused on the deterministic noise such as intersymbol interference (ISI), crosstalk, and SSO noise. To include SSO noise, we co-simulate power distribution network (PDN) and channel models and treat SSO noise as another form of crosstalk. To capture any system nonlinearity, we employ time-domain based multi-edge response (MER) method to characterize the deterministic and passive portion of channels. Then, random noise and timing jitter impact are included via statistical approach. We use GDDR system to demonstrate our simulation flow.
  • Keywords
    crosstalk; integrated memory circuits; statistical analysis; timing jitter; crosstalk; high-speed memory I/O interfaces; intersymbol interference; multiedge response method; power integrity simulation flow; random timing jitter; simultaneous switching events; simultaneous switching output noise; statistical link analysis; transient simulation methods; Bit error rate; Communication system signaling; Computational modeling; Crosstalk; Performance analysis; Phase noise; Power system modeling; System performance; Timing jitter; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2873-1
  • Type

    conf

  • DOI
    10.1109/EPEP.2008.4675867
  • Filename
    4675867