• DocumentCode
    3395692
  • Title

    Compact expressions for period jitter of global binary clock trees

  • Author

    Jang, Jinwook ; Franza, Olivier ; Burleson, Wayne

  • Author_Institution
    Electr. & Comput. Eng., Univ. of Massachusetts, Amherst, MA
  • fYear
    2008
  • fDate
    27-29 Oct. 2008
  • Firstpage
    47
  • Lastpage
    50
  • Abstract
    Period jitter plays a critical role in global clock distribution, because it directly impacts the time available for logic operation between sequential elements in the presence of time-varying supply noise. For a given global clock tree topology, the accurate evaluation of period jitter is not only complicated to establish but also exceedingly compute intensive due to its dependency upon many different design parameters. In this paper, we propose a set of analytical expressions which predict period jitter of global clock tree in a fast and accurate manner. A recursive period jitter expression is formulated for global binary clock trees with 32nm rlc interconnects, and it is approximated to a summation based non-recursive expression. Both expressions predict period jitter in the presence of power supply noise with less than 2.93ps error and a speedup of over 100x compared to full-fledged HSPICE simulations The analytical prediction of the worst case period jitter was made possible by the formulation of the non-recursive expression. The worst case period jitter predictions for several different design assumptions closely match the exact worst case period jitter found based on the numerical searches of recursive expression.
  • Keywords
    SPICE; clocks; trees (electrical); HSPICE simulations; compact expressions; global binary clock trees; global clock tree topology; logic operation; non recursive expression; period jitter; sequential elements; time varying supply noise; Analytical models; Clocks; Frequency; Jitter; Logic; Noise level; Power supplies; Propagation delay; Time varying systems; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2873-1
  • Type

    conf

  • DOI
    10.1109/EPEP.2008.4675873
  • Filename
    4675873