Title :
Effective in-line defect monitoring with variable wafer area coverage
Author :
Kuo, William W. ; Akella, Ram ; Fletcher, Dave
Author_Institution :
California Univ., Berkeley, CA, USA
Abstract :
The main purpose of this paper is to provide yield management personnel in semiconductor fabs an understanding of the impact of partial wafer area coverage when performing in-line defect monitoring. We present a heuristic approach of dynamic sampling with variable wafer area scanning, through a numerical example based on actual fab data
Keywords :
image processing; inspection; integrated circuit yield; monitoring; statistical process control; SPC charts; dynamic sampling; heuristic approach; in-line defect monitoring; partial wafer area coverage; semiconductor fabrication lines; variable wafer area coverage; wafer area scanning; yield management; Digital images; Filters; Image sampling; Inspection; Monitoring; Personnel; Process control; Sampling methods; Scattering; Semiconductor device manufacture;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1997. IEEE/SEMI
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-4050-7
DOI :
10.1109/ASMC.1997.630750
