DocumentCode
3396042
Title
Analysis of EBG structures using SPICE models of multiple planes
Author
Kobayashi, Naoki ; Morishita, Ken ; Harada, Takashi
Author_Institution
NEC Syst. Jisso Res. Labs., Sagamihara
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
111
Lastpage
114
Abstract
Compared to measurements, SPICE models of multiple planes are demonstrated to be effective for analyzing electromagnetic band gap (EBG) structures where unit cells are parallel waveguides coupled to stacked cavities through via posts.
Keywords
SPICE; photonic band gap; voids (solid); waveguides; SPICE models; electromagnetic band gap structures; multiple planes; parallel waveguides; stacked cavities; Coupled mode analysis; Electromagnetic analysis; Electromagnetic measurements; Electromagnetic modeling; Electromagnetic waveguides; Metamaterials; Periodic structures; Planar waveguides; SPICE; Waveguide discontinuities;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2873-1
Type
conf
DOI
10.1109/EPEP.2008.4675890
Filename
4675890
Link To Document