DocumentCode :
3396112
Title :
Hierarchical and adaptive finite-element reduction-recovery method for large-scale power and signal integrity analysis of high-speed IC and packaging structures
Author :
Gan, Houle ; He, Qing ; Jiao, Dan
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
fYear :
2008
fDate :
27-29 Oct. 2008
Firstpage :
127
Lastpage :
130
Abstract :
This paper proposes a hierarchical and adaptive finite-element reduction-recovery method for power and signal integrity analysis of high-speed IC and packaging structures. This method rigorously reduces the matrix of a multilayer system of O(N) to that of a single-cell one of O(1) regardless of the original problem size. More important, the matrix reduction is achieved analytically, and hence the CPU and memory overheads are minimal. In addition, the reduction preserves the sparsity of the original matrix. As a result, the matrix factorization cost of the proposed method is reduced to a constant. The CPU cost at each time step scales linearly with the number of unknowns to be recovered. Furthermore, an adaptive reduction-recovery scheme is developed to perform reduction and recovery in the active layers only, and hence further reducing the complexity of the proposed method. Numerical and experimental results demonstrate its performance.
Keywords :
finite element analysis; high-speed integrated circuits; integrated circuit packaging; matrix algebra; CPU; adaptive finite-element reduction-recovery method; high-speed IC; large-scale power analysis; matrix reduction; memory overheads; multilayer system; packaging structures; signal integrity analysis; Central Processing Unit; Circuit simulation; Costs; Finite element methods; High speed integrated circuits; Integrated circuit packaging; Large-scale systems; Nonhomogeneous media; Signal analysis; Sparse matrices; On-chip; electromagnetic simulation; large-scale; power and signal integrity; transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-2873-1
Type :
conf
DOI :
10.1109/EPEP.2008.4675894
Filename :
4675894
Link To Document :
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