• DocumentCode
    3396112
  • Title

    Hierarchical and adaptive finite-element reduction-recovery method for large-scale power and signal integrity analysis of high-speed IC and packaging structures

  • Author

    Gan, Houle ; He, Qing ; Jiao, Dan

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN
  • fYear
    2008
  • fDate
    27-29 Oct. 2008
  • Firstpage
    127
  • Lastpage
    130
  • Abstract
    This paper proposes a hierarchical and adaptive finite-element reduction-recovery method for power and signal integrity analysis of high-speed IC and packaging structures. This method rigorously reduces the matrix of a multilayer system of O(N) to that of a single-cell one of O(1) regardless of the original problem size. More important, the matrix reduction is achieved analytically, and hence the CPU and memory overheads are minimal. In addition, the reduction preserves the sparsity of the original matrix. As a result, the matrix factorization cost of the proposed method is reduced to a constant. The CPU cost at each time step scales linearly with the number of unknowns to be recovered. Furthermore, an adaptive reduction-recovery scheme is developed to perform reduction and recovery in the active layers only, and hence further reducing the complexity of the proposed method. Numerical and experimental results demonstrate its performance.
  • Keywords
    finite element analysis; high-speed integrated circuits; integrated circuit packaging; matrix algebra; CPU; adaptive finite-element reduction-recovery method; high-speed IC; large-scale power analysis; matrix reduction; memory overheads; multilayer system; packaging structures; signal integrity analysis; Central Processing Unit; Circuit simulation; Costs; Finite element methods; High speed integrated circuits; Integrated circuit packaging; Large-scale systems; Nonhomogeneous media; Signal analysis; Sparse matrices; On-chip; electromagnetic simulation; large-scale; power and signal integrity; transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2873-1
  • Type

    conf

  • DOI
    10.1109/EPEP.2008.4675894
  • Filename
    4675894