• DocumentCode
    3396200
  • Title

    Characterization of halogen-free package materials using cavity resonators

  • Author

    Aygun, Kemal ; Hu, Grace

  • Author_Institution
    Assembly & Test Technol. Dev., Intel Corp., Chandler, AZ
  • fYear
    2008
  • fDate
    27-29 Oct. 2008
  • Firstpage
    147
  • Lastpage
    150
  • Abstract
    Dielectric properties of substrate materials have a significant impact on electrical performance of packages including signaling power loss, propagation delay and crosstalk. With the focus on halogen-free (HF) package substrates, it is critical to understand the impact of this material change on high-speed signal integrity. In this paper, a closed rectangular cavity resonator and an open Fabry-Perot cavity resonator are proposed to characterize package materials over 2 GHz - 28 GHz range. The paper first studies the metrology repeatability and sensitivity to sample positioning and sample thickness. Then the proposed metrologies are used for electrical characterization of both HF and halogenated (H) package core materials. Finally, the impact of the core material change on the high-speed signaling performance is investigated through a modeling study for a typical differential input/output (IO) interface.
  • Keywords
    cavity resonators; dielectric properties; electronics packaging; Fabry-Perot cavity resonator; cavity resonators; closed rectangular cavity resonator; crosstalk; dielectric properties; frequency 2 GHz to 28 GHz; halogen-free package materials; high-speed signal integrity; input-output interface; metrology repeatability; power loss signaling; propagation delay; sample positioning sensitivity; substrate materials; Cavity resonators; Dielectric losses; Dielectric materials; Dielectric substrates; Hafnium; Metrology; Packaging; Performance loss; Propagation delay; Propagation losses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2873-1
  • Type

    conf

  • DOI
    10.1109/EPEP.2008.4675899
  • Filename
    4675899