DocumentCode
3396200
Title
Characterization of halogen-free package materials using cavity resonators
Author
Aygun, Kemal ; Hu, Grace
Author_Institution
Assembly & Test Technol. Dev., Intel Corp., Chandler, AZ
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
147
Lastpage
150
Abstract
Dielectric properties of substrate materials have a significant impact on electrical performance of packages including signaling power loss, propagation delay and crosstalk. With the focus on halogen-free (HF) package substrates, it is critical to understand the impact of this material change on high-speed signal integrity. In this paper, a closed rectangular cavity resonator and an open Fabry-Perot cavity resonator are proposed to characterize package materials over 2 GHz - 28 GHz range. The paper first studies the metrology repeatability and sensitivity to sample positioning and sample thickness. Then the proposed metrologies are used for electrical characterization of both HF and halogenated (H) package core materials. Finally, the impact of the core material change on the high-speed signaling performance is investigated through a modeling study for a typical differential input/output (IO) interface.
Keywords
cavity resonators; dielectric properties; electronics packaging; Fabry-Perot cavity resonator; cavity resonators; closed rectangular cavity resonator; crosstalk; dielectric properties; frequency 2 GHz to 28 GHz; halogen-free package materials; high-speed signal integrity; input-output interface; metrology repeatability; power loss signaling; propagation delay; sample positioning sensitivity; substrate materials; Cavity resonators; Dielectric losses; Dielectric materials; Dielectric substrates; Hafnium; Metrology; Packaging; Performance loss; Propagation delay; Propagation losses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2873-1
Type
conf
DOI
10.1109/EPEP.2008.4675899
Filename
4675899
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