• DocumentCode
    3396294
  • Title

    How to develop a qualification test plan for RoHS products

  • Author

    Silverman, Mike ; Schenkelberg, Fred ; Hillman, Craig

  • Author_Institution
    Ops A La Carte, LLC, Saratoga, CA
  • fYear
    2008
  • fDate
    28-31 Jan. 2008
  • Firstpage
    375
  • Lastpage
    380
  • Abstract
    The subject matter we consider in this paper are the significant reliability uncertainties around lead-free solder and how to best consider these risks and mitigate them so as not to take a hit in the area of reliability during the lead-free transition. Like the rest of the electronics industry, your products will transition to restriction of hazardous substances (RoHS) compliance. This includes the transition to lead-free solder, and at this time, there are significant reliability uncertainties around lead-free solder. Even if your product does not need to be compliant, the materials and processes that make up your product are changing. During this time of rapid transition, there is a significant new body of knowledge to understand to determine the areas of greatest risk to the reliability of your product. In this paper, we will highlight a few of these significant risk areas and how to best mitigate these risks during the transition.
  • Keywords
    RoHS compliance; electronics industry; quality control; reliability; risk analysis; solders; RoHS products; electronics industry; lead-free solder; qualification test plan; reliability uncertainties; restriction-of-hazardous-substances; risks mitigation; Delamination; Environmentally friendly manufacturing techniques; Failure analysis; Lead; Materials reliability; Moisture; Qualifications; Soldering; Testing; Tin; RoHS; delamination; qualification; underplate;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability and Maintainability Symposium, 2008. RAMS 2008. Annual
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0149-144X
  • Print_ISBN
    978-1-4244-1460-4
  • Electronic_ISBN
    0149-144X
  • Type

    conf

  • DOI
    10.1109/RAMS.2008.4925825
  • Filename
    4925825