DocumentCode
3396326
Title
2008 IEEE electrical performance of electronic packaging suppression of vertical coupling using Electromagnetic Band Gap structures
Author
Sankaran, Nithya ; Huh, Suzanne ; Swaminathan, Madhavan ; Tummala, Rao
Author_Institution
Packaging Res. Centre, Georgia Inst. of Technol., Atlanta, GA
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
173
Lastpage
176
Abstract
This paper for the first time demonstrates the use of electromagnetic band gap (EBG) structures for isolation between multiple plane pairs along the vertical direction. Planar EBG structures have been applied for the suppression of vertical noise coupling in the GHz range of frequencies. Simulation and measurement results showing good isolation in the stop bands of the EBGs are presented.
Keywords
electronics packaging; photonic band gap; IEEE electrical performance; electromagnetic band gap structures; electronic packaging suppression; vertical noise coupling; Apertures; Capacitors; Dielectric substrates; Electromagnetic coupling; Electromagnetic measurements; Electronics packaging; Frequency; Metamaterials; Nonhomogeneous media; Periodic structures;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2873-1
Type
conf
DOI
10.1109/EPEP.2008.4675906
Filename
4675906
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