DocumentCode
3396371
Title
Effect of magnetic field treatment on properties of thermosetting polymers and their composites
Author
Han, Baozhong ; Ma, Fenglian ; Feng, Tao ; Jiang, Hui ; Wang, Yanjie
Author_Institution
Key Lab. of Eng. Dielectric & Its Applic., Harbin Univ. of Sci. & Technol., Harbin, China
fYear
2009
fDate
19-23 July 2009
Firstpage
1158
Lastpage
1162
Abstract
Magnetic phenomenon is one of the most fundamental phenomena of substances. All substances have strong or weak magnetic property, and have different responds to external magnetic field. In this study, the effect of the magnetic field applied during the cross-linking process of polyethylene (PE) and the vulcanization (or cure) process of silicone rubber (SIR) and epoxy resin (EP) and their composites on the properties of polymer materials is explored. Experimental results show that the magnetic field treatment can accelerate the cross-linking or vulcanization (or cure) of cross-linked PE (XLPE), SIR and EP, and change the arrangement and the spatial network structure of these polymer molecules. Moreover, the magnetic field treatment can increase the volume electrical resistivity of the prepared thermosetting polymers and lead to a change in the dielectric properties of thermosetting polymer-based composites. The change extent and trend of dielectric properties depend on the properties of each component in system.
Keywords
composite materials; curing; electrical resistivity; polymers; silicone rubber; thermomagnetic treatment; vulcanisation; cross-linking process; curing process; epoxy resin; external magnetic field; magnetic field treatment; magnetic property; polymer molecule; silicone rubber; thermosetting polymer-based composite; volume electrical resistivity; vulcanization process; Acceleration; Composite materials; Dielectrics; Epoxy resins; Magnetic fields; Magnetic materials; Magnetic properties; Polyethylene; Polymers; Rubber; composites; dielectric properties; magnetic field; polymer;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location
Harbin
Print_ISBN
978-1-4244-4367-3
Electronic_ISBN
978-1-4244-4368-0
Type
conf
DOI
10.1109/ICPADM.2009.5252279
Filename
5252279
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