DocumentCode :
3396541
Title :
Association analysis between erythrocyte membrane surface structure and genes in Cyprinus carpio with different vitality at lower temperature
Author :
Liang, Liqun ; Chang, Yumei ; Lei, Qingquan
Author_Institution :
Coll. of Electr. & Electron. Eng., Harbin Univ. of Sci. & Technol., Harbin, China
fYear :
2009
fDate :
19-23 July 2009
Firstpage :
1196
Lastpage :
1201
Abstract :
Erythrocyte membrane surface structure in common carp (Cyprinus carpio) with different vitalities at lower temperatures was observed using atomic force microscope (AFM). The results showed that carp individuals with cold tolerance have spine heave in its erythrocyte membrane edge, whereas the counterparts haven´t this structure. Two EST markers named of CC005 and CC062 isolated from cDNA library constructed under cooling temperature was found to be connected with the presence of spine heave in erythrocyte membrane. A significance (X2=21.345, P<0.01) was detected in genotypic frequencies related to the presence of spine heave obtained simultaneously at CC005 and CC062. Thus, we inferred that polymorphisms of two ESTs have a collaborative effect on the conformation of spine heave. This study will offer supportive theoretics to conduct blood physiological research of cold adaption in fish species.
Keywords :
atomic force microscopy; biomembranes; biothermics; blood; cellular biophysics; genetics; molecular biophysics; molecular configurations; polymorphism; AFM; Cyprinus carpio; EST marker; association analysis; atomic force microscope; blood physiological research; cooling temperature; erythrocyte membrane; erythrocyte membrane edge; fish species; genes; polymorphisms; surface structure; Atomic force microscopy; Biomembranes; Blood; Collaboration; Cooling; Frequency; Libraries; Marine animals; Surface structures; Temperature; Cyprinus carpio; EST; erythrocyte membrane; lower temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-4367-3
Electronic_ISBN :
978-1-4244-4368-0
Type :
conf
DOI :
10.1109/ICPADM.2009.5252288
Filename :
5252288
Link To Document :
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