• DocumentCode
    3396541
  • Title

    Association analysis between erythrocyte membrane surface structure and genes in Cyprinus carpio with different vitality at lower temperature

  • Author

    Liang, Liqun ; Chang, Yumei ; Lei, Qingquan

  • Author_Institution
    Coll. of Electr. & Electron. Eng., Harbin Univ. of Sci. & Technol., Harbin, China
  • fYear
    2009
  • fDate
    19-23 July 2009
  • Firstpage
    1196
  • Lastpage
    1201
  • Abstract
    Erythrocyte membrane surface structure in common carp (Cyprinus carpio) with different vitalities at lower temperatures was observed using atomic force microscope (AFM). The results showed that carp individuals with cold tolerance have spine heave in its erythrocyte membrane edge, whereas the counterparts haven´t this structure. Two EST markers named of CC005 and CC062 isolated from cDNA library constructed under cooling temperature was found to be connected with the presence of spine heave in erythrocyte membrane. A significance (X2=21.345, P<0.01) was detected in genotypic frequencies related to the presence of spine heave obtained simultaneously at CC005 and CC062. Thus, we inferred that polymorphisms of two ESTs have a collaborative effect on the conformation of spine heave. This study will offer supportive theoretics to conduct blood physiological research of cold adaption in fish species.
  • Keywords
    atomic force microscopy; biomembranes; biothermics; blood; cellular biophysics; genetics; molecular biophysics; molecular configurations; polymorphism; AFM; Cyprinus carpio; EST marker; association analysis; atomic force microscope; blood physiological research; cooling temperature; erythrocyte membrane; erythrocyte membrane edge; fish species; genes; polymorphisms; surface structure; Atomic force microscopy; Biomembranes; Blood; Collaboration; Cooling; Frequency; Libraries; Marine animals; Surface structures; Temperature; Cyprinus carpio; EST; erythrocyte membrane; lower temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-4367-3
  • Electronic_ISBN
    978-1-4244-4368-0
  • Type

    conf

  • DOI
    10.1109/ICPADM.2009.5252288
  • Filename
    5252288